Electroplating solutions

NBT has designed specialised electroplating solutions based on many years of engineering experience and application expertise for MEMS, semiconductor industries, PCBs and photovoltaic technologies. The portfolio comprises plating solutions for nickel, gold, silver, tin, Palladium, indium, nickel manganese, or bismuth.

Product Application Features
NB Semiplate Au 100 surface finishing
bond pads		 very stable bath, sulfite based
very uniform thickness,
shiny surface, arsenite grain refiner
low temperature plating
NB Semiplate Au 100 TL surface finishing
bond pads		 very stable bath, sulfite based
very uniform thickness,
shiny surface, grain refiner free of arsenite
low temperature plating
NB Semiplate Cu 100 conducting lines
sacrificial layer		 sulfuric acid based,
shiny surface, uniform thickness,
low stress
NB Semiplate Cu 150 conducting lines
sacrificial layer		 designed for inert anode process
sulfuric acid based,
shiny surface, uniform thickness
NB Semiplate Sn 100 soldering
surface finish		 MSA based, good bonding
NB Semiplate Sn 150 soldering
surface finish		 designed for inert anode
process, MSA based,
good bonding
NB Semiplate Ni 100 mechanical elements,
barrier layer		 high purity bath and deposit,
medium temperature plating,
low stress,
controlled mechanical properties
NB Semiplate NiMn 100 mechanical elements
(switches, relays, tethers)		 low-creep Ni, stable grain size under temperature and mechanical load
NB Semiplate In 100 soldering or bonding alkaline, non-cyanide
matte, fine-grained surface
NB Semiplate Ag 100 conductors, surface finish alkaline, cyanide-free Ag,
compatible with resist mask
NB Semiplate Bi 100 absorber layer
in space applications		 pure bismuth plating solution
NB Semiplate Pd 200 surface finish
barrier layer		 alkaline bath, 0,3 to 1μm thickness
compatible with resist
NB sunNiSi 100 porous Si etching and
Ni plating from one solution		 ethanol-free,
low HF concentration
plates Ni in nm-pores
excellent adhesion