NBT offers different kinds of special designed labtools for wet etching and plating.

NBT’s suncup® is the key enabler for smart plating concepts in the field of solar cell metallization. The suncup works in a fountain type configuration with the process side face down. The wafers process is single-side without chuck, the backside keeps dry during wet process. Beside of plating, all wet processes can be performed without restrictions for or from the backside.

To optimize electroplating solutions NBT has constructed a testing cell for volumes less than three litres. Working with such small quantities during the development process of electrolytes allows the variation of different compounds without wasting large amounts of material.


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